- Patent Title: Semiconductor package having an additional material with a comparative tracking index (CTI) higher than that of encapsulant resin material formed between two terminals
-
Application No.: US16239796Application Date: 2019-01-04
-
Publication No.: US11545419B2Publication Date: 2023-01-03
- Inventor: Takuya Kadoguchi , Takahiro Hirano , Arata Harada , Tomomi Okumura , Keita Fukutani , Masayoshi Nishihata
- Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA , DENSO CORPORATION
- Applicant Address: JP Toyota; JP Kariya
- Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA,DENSO CORPORATION
- Current Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA,DENSO CORPORATION
- Current Assignee Address: JP Toyota; JP Kariya
- Agency: Oliff PLC
- Priority: JPJP2013-256494 20131211
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/00 ; H01L23/31 ; H01L23/433 ; H01L29/739 ; H01L29/861 ; H02M7/00 ; H01L23/051

Abstract:
A semiconductor device includes a first switching element; a second switching element; a first metal member; a second metal member; a first terminal that has a potential on a high potential side; a second terminal that has a potential on a low potential side; a third terminal that has a midpoint potential; and a resin part. A first potential part has potential equal to potential of the first terminal. A second potential part has potential equal to potential of the second terminal. A third potential part has potential equal to potential of the third terminal. A first creepage distance between the first potential part and the second potential part is longer than a minimum value of a second creepage distance between the first potential part and the third potential part and a third creepage distance between the second potential part and the third potential part.
Public/Granted literature
- US20190139874A1 SEMICONDUCTOR DEVICE HAVING TWO SWITCHING ELEMENTS Public/Granted day:2019-05-09
Information query
IPC分类: