Invention Grant
- Patent Title: High current packages with reduced solder layer count
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Application No.: US16787327Application Date: 2020-02-11
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Publication No.: US11545420B2Publication Date: 2023-01-03
- Inventor: Yiqi Tang , Liang Wan , William Todd Harrison , Manu Joseph Prakuzhy , Rajen Manicon Murugan
- Applicant: TEXAS INSTRUMENTS INCORPORATED
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Yudong Kim; Frank D. Cimino
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H02M3/158 ; H01L23/00

Abstract:
In some examples, a direct current (DC)-DC power converter package comprises a controller, a conductive member, and a first field effect transistor (FET) coupled to the controller and having a first source and a first drain, the first FET coupled to a first portion of the conductive member. The package also comprises a second FET coupled to the controller and having a second source and a second drain, the second FET coupled to a second portion of the conductive member, the first and second portions of the conductive member being non-overlapping in a horizontal plane. The first and second FETs are non-overlapping.
Public/Granted literature
- US20200258825A1 HIGH CURRENT PACKAGES WITH REDUCED SOLDER LAYER COUNT Public/Granted day:2020-08-13
Information query
IPC分类: