Invention Grant
- Patent Title: Multi-die module with contactless coupler and a coupling loss reduction structure
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Application No.: US17150825Application Date: 2021-01-15
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Publication No.: US11545466B2Publication Date: 2023-01-03
- Inventor: Benjamin Stassen Cook , Bichoy Bahr , Baher Haroun
- Applicant: TEXAS INSTRUMENTS INCORPORATED
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Ray A. King; Frank D. Cimino
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L21/673 ; H03B5/08 ; H01F38/14
Abstract:
A multi-die module includes a first die with a first electronic device and a second die with a second electronic device. The multi-die module also includes a contactless coupler configured to convey signals between the first electronic device and the second electronic device. The multi-die module also includes a coupling loss reduction structure.
Public/Granted literature
- US20210143130A1 MULTI-DIE MODULE WITH CONTACTLESS COUPLER AND A COUPLING LOSS REDUCTION STRUCTURE Public/Granted day:2021-05-13
Information query
IPC分类:
