Invention Grant
- Patent Title: Three-dimensional memory device and method
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Application No.: US17157489Application Date: 2021-01-25
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Publication No.: US11545500B2Publication Date: 2023-01-03
- Inventor: Bo-Feng Young , Sai-Hooi Yeong , Han-Jong Chia , Sheng-Chen Wang , Yu-Ming Lin
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L27/11551
- IPC: H01L27/11551 ; H01L27/11519 ; G11C8/14 ; G11C7/18

Abstract:
In an embodiment, a device includes: a first dielectric layer having a first sidewall; a second dielectric layer having a second sidewall; a word line between the first dielectric layer and the second dielectric layer, the word line having an outer sidewall and an inner sidewall, the inner sidewall recessed from the outer sidewall, the first sidewall, and the second sidewall; a memory layer extending along the outer sidewall of the word line, the inner sidewall of the word line, the first sidewall of the first dielectric layer, and the second sidewall of the second dielectric layer; and a semiconductor layer extending along the memory layer.
Information query
IPC分类: