Invention Grant
- Patent Title: Superjunction device with oxygen inserted Si-layers
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Application No.: US16930500Application Date: 2020-07-16
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Publication No.: US11545545B2Publication Date: 2023-01-03
- Inventor: Martin Poelzl , Robert Haase , Sylvain Leomant , Maximilian Roesch , Ravi Keshav Joshi , Andreas Meiser , Xiaoqiu Huang , Ling Ma
- Applicant: Infineon Technologies Austria AG
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/08 ; H01L29/10 ; H01L29/423 ; H01L29/66 ; H01L29/739 ; H01L29/78

Abstract:
A semiconductor device includes a source region and a drain region of a first conductivity type, a body region of a second conductivity type between the source region and the drain region, a gate configured to control current through a channel of the body region, a drift zone of the first conductivity type between the body region and the drain region, a superjunction structure formed by a plurality of regions of the second conductivity type laterally spaced apart from one another by intervening regions of the drift zone, and a diffusion barrier structure disposed along sidewalls of the regions of the second conductivity type of the superjunction structure. The diffusion barrier structure includes alternating layers of Si and oxygen-doped Si and a Si capping layer on the alternating layers of Si and oxygen-doped Si.
Public/Granted literature
- US20200350401A1 Superjunction Device with Oxygen Inserted Si-Layers Public/Granted day:2020-11-05
Information query
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