- Patent Title: Semiconductor device and semiconductor device manufacturing method
-
Application No.: US17047236Application Date: 2019-04-17
-
Publication No.: US11545551B2Publication Date: 2023-01-03
- Inventor: Shunpei Yamazaki , Shinya Sasagawa , Erika Takahashi , Katsuaki Tochibayashi , Ryo Arasawa
- Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Applicant Address: JP Atsugi
- Assignee: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Current Assignee: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Current Assignee Address: JP Atsugi
- Agency: Fish & Richardson P.C.
- Priority: JPJP2018-087261 20180427
- International Application: PCT/IB2019/053159 WO 20190417
- International Announcement: WO2019/207418 WO 20191031
- Main IPC: H01L29/24
- IPC: H01L29/24 ; H01L27/12 ; H01L27/108

Abstract:
A semiconductor device in which variations in characteristics, deterioration of elements, and abnormality in shape are inhibited is provided. The semiconductor device includes a first region including a plurality of elements and a second region including a plurality of dummy elements. The second region is provided in an outer edge of the first region, and the element and the dummy element each include an oxide semiconductor. The element and the dummy element have the same structure, and a structure body included in the element and a structure body included in the dummy element are formed with the same material and provided in the same layer. The oxide semiconductor includes In, an element M (M is Al, Ga, Y, or Sn), and Zn.
Public/Granted literature
- US20210175334A1 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD Public/Granted day:2021-06-10
Information query
IPC分类: