Invention Grant
- Patent Title: Embedded source or drain region of transistor with downward tapered region under facet region
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Application No.: US17067107Application Date: 2020-10-09
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Publication No.: US11545572B2Publication Date: 2023-01-03
- Inventor: Che-Cheng Chang , Tung-Wen Cheng , Zhe-Hao Zhang , Yung Jung Chang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT Law
- Agent Anthony King
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/78

Abstract:
In some embodiments, a field effect transistor (FET) structure comprises a body structure, dielectric structures, a gate structure and a source or drain region. The gate structure is formed over the body structure. The source or drain region is embedded in the body structure beside the gate structure, and abuts and is extended beyond the dielectric structure. The source or drain region contains stressor material with a lattice constant different from that of the body structure. The source or drain region comprises a first region formed above a first level at a top of the dielectric structures and a second region that comprises downward tapered side walls formed under the first level and abutting the corresponding dielectric structures.
Public/Granted literature
- US11594635B2 Embedded source or drain region of transistor with downward tapered region under facet region Public/Granted day:2023-02-28
Information query
IPC分类: