Invention Grant
- Patent Title: Semiconductor structure with in-device high resistivity polycrystalline semiconductor element and method
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Application No.: US17114554Application Date: 2020-12-08
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Publication No.: US11545577B2Publication Date: 2023-01-03
- Inventor: Siva P. Adusumilli , John J. Ellis-Monaghan , Steven M. Shank , Yves T. Ngu , Michael J. Zierak
- Applicant: GLOBALFOUNDRIES U.S. Inc.
- Applicant Address: US CA Santa Clara
- Assignee: GLOBALFOUNDRIES U.S. Inc.
- Current Assignee: GLOBALFOUNDRIES U.S. Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Hoffman Warnick LLC
- Agent Francois Pagette
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L21/8234 ; H01L21/02 ; H01L29/04

Abstract:
Disclosed is a structure including a semiconductor layer with a device area and, within the device area, a monocrystalline portion and polycrystalline portion(s) that extend through the monocrystalline portion. The structure includes an active device including a device component, which is in device area and which includes polycrystalline portion(s). For example, the device can be a field effect transistor (FET) (e.g., a simple FET or a multi-finger FET for a low noise amplifier or RF switch) with at least one source/drain region, which is in the device area and which includes at least one polycrystalline portion that extends through the monocrystalline portion. The embodiments can vary with regard to the type of structure (e.g., bulk or SOI), with regard to the type of device therein, and also with regard to the number, size, shape, location, orientation, etc. of the polycrystalline portion(s). Also disclosed is a method for forming the structure.
Public/Granted literature
- US20220181501A1 SEMICONDUCTOR STRUCTURE WITH IN-DEVICE HIGH RESISTIVITY POLYCRYSTALLINE SEMICONDUCTOR ELEMENT AND METHOD Public/Granted day:2022-06-09
Information query
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