Invention Grant
- Patent Title: Semiconductor device and method for manufacturing semiconductor device
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Application No.: US17047710Application Date: 2019-04-18
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Publication No.: US11545578B2Publication Date: 2023-01-03
- Inventor: Shunpei Yamazaki , Yasumasa Yamane , Takashi Hirose , Teruyuki Fujii , Hajime Kimura , Daigo Shimada
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Atsugi
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi
- Agency: Robinson Intellectual Property Law Office
- Agent Eric J. Robinson
- Priority: JPJP2018-086719 20180427,JPJP2018-086722 20180427,JPJP2018-147766 20180806,JPJP2018-150514 20180809
- International Application: PCT/IB2019/053205 WO 20190418
- International Announcement: WO2019/207429 WO 20191031
- Main IPC: H01L27/00
- IPC: H01L27/00 ; H01L29/00 ; H01L29/786 ; H01L29/24 ; H01L29/51 ; H01L21/00

Abstract:
A semiconductor device with high reliability is provided. The semiconductor device includes a first insulator, a second insulator, and a transistor; the transistor includes an oxide in a channel formation region; the oxide is surrounded by the first insulator; and the first insulator is surrounded by the second insulator. The first insulator includes a region with a lower hydrogen concentration than the second insulator. Alternatively, the first insulator includes a region with a lower hydrogen concentration than the second insulator and with a lower nitrogen concentration than the second insulator.
Public/Granted literature
- US20210167211A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2021-06-03
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