Invention Grant
- Patent Title: Vertical coupling structure for antenna feeds
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Application No.: US17369782Application Date: 2021-07-07
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Publication No.: US11545752B1Publication Date: 2023-01-03
- Inventor: Gordon Coutts
- Applicant: Amazon Technologies, Inc.
- Applicant Address: US WA Seattle
- Assignee: Amazon Technologies, Inc.
- Current Assignee: Amazon Technologies, Inc.
- Current Assignee Address: US WA Seattle
- Agency: Lowenstein Sandler LLP
- Main IPC: H01L35/00
- IPC: H01L35/00 ; H01Q9/04 ; H05K1/02 ; H05K1/14 ; H05K1/11 ; H01Q3/26

Abstract:
Technologies directed to coupling structures for antenna feeds of phased array antennas are described. One circuit board includes a first layer with a first portion of a RF coupling structure, a second layer with a second portion of the RF coupling structure, and a first insulation layer located between the first layer and the second layer. The RF coupling structure is configured to electromagnetically couple a first conductive trace on the first layer and a second conductive trace on the second layer at RF frequencies. The circuit board also includes an RF shielding structure coupled to a ground connection on the second layer and located in the first insulation layer. The RF shielding structure is configured to operate as a RF short circuit between the ground connection and a third conductive trace on the first layer at RF frequencies.
Information query
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