Invention Grant
- Patent Title: Modular motherboard for a computer system and method thereof
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Application No.: US16057580Application Date: 2018-08-07
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Publication No.: US11546992B2Publication Date: 2023-01-03
- Inventor: Charles C. Hill , Franz Michael Schuette
- Applicant: Sanmina Corporation
- Applicant Address: US CA San Jose
- Assignee: Sanmina Corporation
- Current Assignee: Sanmina Corporation
- Current Assignee Address: US CA San Jose
- Agency: Loza & Loza, LLP
- Agent Heidi Eisenhut
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K3/36 ; H05K1/14 ; H05K3/30 ; G06F13/40

Abstract:
One feature pertains to a modular design of a motherboard for a computer system. The mother board is disaggregated into a CPU board and an IO board. The CPU board contains at least one CPU, the associated memory subsystem and the voltage regulator module. The integrated IO ports escape to a high speed connector mating with its counterpart on an IO board which contains all peripheral devices including system logic not part of the CPU. In a multi-socket configuration the CPUs are on the CPU board and the processor interconnects are routed directly in a point to point manner.
Public/Granted literature
- US20190045634A1 MODULAR MOTHERBOARD FOR A COMPUTER SYSTEM AND METHOD THEREOF Public/Granted day:2019-02-07
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