Invention Grant
- Patent Title: Direct data bus between modular devices
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Application No.: US16924152Application Date: 2020-07-08
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Publication No.: US11547011B2Publication Date: 2023-01-03
- Inventor: Victor Teeter , Shree Rathinasamy
- Applicant: DELL PRODUCTS L.P.
- Applicant Address: US TX Round Rock
- Assignee: DELL PRODUCTS L.P.
- Current Assignee: DELL PRODUCTS L.P.
- Current Assignee Address: US TX Round Rock
- Agency: North Weber & Baugh LLP
- Main IPC: G06F1/16
- IPC: G06F1/16 ; H05K5/00 ; H05K7/00 ; H05K7/14 ; H05K5/02

Abstract:
Systems and methods for establishing a direct communication between modular electronic devices comprise a connector assembly implemented in a first modular device and having a connector that is implemented in a housing. The housing holding the connector may use a spring to mate with a receptacle of a second modular device, e.g., a module in a chassis in a data center, to establish a releasable direct connection without utilizing a backplane.
Public/Granted literature
- US20220015255A1 DIRECT DATA BUS BETWEEN MODULAR DEVICES Public/Granted day:2022-01-13
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