Invention Grant
- Patent Title: Electromagnetic wave absorber
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Application No.: US16621487Application Date: 2018-06-12
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Publication No.: US11547031B2Publication Date: 2023-01-03
- Inventor: Takehiro Ui , Hiroichi Ukei
- Applicant: NITTO DENKO CORPORATION
- Applicant Address: JP Ibaraki
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Ibaraki
- Agency: WHDA, LLP
- Priority: JPJP2017-116770 20170614
- International Application: PCT/JP2018/022480 WO 20180612
- International Announcement: WO2018/230578 WO 20181220
- Main IPC: B32B3/00
- IPC: B32B3/00 ; H05K9/00 ; B32B7/025 ; B32B15/04 ; B32B15/08

Abstract:
An electromagnetic wave absorber includes an electromagnetic wave-absorbing layer (10) and an adhesive layer (20). The adhesive layer (20) is disposed on at least one surface of the electromagnetic wave-absorbing layer (10). The electromagnetic wave absorber is capable of being adhered to a surface having a step in such a manner that the adhesive layer (20) is in contact with the surface. The adhesive layer (20) has a thickness equal to or greater than a reference height determined by subtracting 0.1 mm from the height of the step. In the electromagnetic wave absorber, a return loss ΔR defined by ΔR=Rt−Rr is 15 dB or more. Rt is a reflection amount of a 76-GHz electromagnetic wave and is measured for a reference specimen. Rr is a reflection amount of a 76-GHz electromagnetic wave and is measured for a specimen obtained by adhering the electromagnetic wave absorber.
Public/Granted literature
- US20200178426A1 ELECTROMAGNETIC WAVE ABSORBER Public/Granted day:2020-06-04
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