Invention Grant
- Patent Title: Implantable sensor enclosure with thin sidewalls
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Application No.: US16594155Application Date: 2019-10-07
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Publication No.: US11547320B2Publication Date: 2023-01-10
- Inventor: Harry Rowland , Michael Nagy
- Applicant: ENDOTRONIX, INC.
- Applicant Address: US IL Lisle
- Assignee: ENDOTRONIX, INC.
- Current Assignee: ENDOTRONIX, INC.
- Current Assignee Address: US IL Lisle
- Agency: McDonald Hopkins LLC
- Main IPC: A61B5/02
- IPC: A61B5/02 ; A61B5/07 ; A61B5/00 ; A61B5/0215
Abstract:
A wireless circuit includes a housing, such as a hermetic housing, and at least one antenna coil wound about a coil axis within the housing. The coil axis may be substantially parallel to at least one wall of the housing, wherein the wall parallel to the coil axis is substantially thinner than other walls of the housing.
Public/Granted literature
- US20200029857A1 IMPLANTABLE SENSOR ENCLOSURE WITH THIN SIDEWALLS Public/Granted day:2020-01-30
Information query
