Invention Grant
- Patent Title: Implant and kit for treating a bone defect
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Application No.: US16461658Application Date: 2017-11-15
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Publication No.: US11547568B2Publication Date: 2023-01-10
- Inventor: Wolfgang Abele , Georg Hettich , Silke Koenig
- Applicant: Aesculap AG
- Applicant Address: DE Tuttlingen
- Assignee: Aesculap AG
- Current Assignee: Aesculap AG
- Current Assignee Address: DE Tuttlingen
- Agency: Lewis Kohn & Walker LLP
- Agent David M. Kohn
- Priority: DE102016222603.7 20161116
- International Application: PCT/EP2017/079312 WO 20171115
- International Announcement: WO2018/091524 WO 20180524
- Main IPC: A61F2/28
- IPC: A61F2/28 ; A61L27/12 ; A61L27/20 ; A61L27/22 ; A61F2/30
Abstract:
An implant for treating a bone defect wherein the implant comprises osteoconductive supporting bodies and an insertion aid. The insertion aid is designed for insertion of the osteoconductive supporting bodies into a bone defect and for holding together the osteoconductive supporting bodies. Also disclosed is a kit comprised of an implant for treating a bone defect.
Public/Granted literature
- US20190350713A1 Implant and Kit for Treating a Bone Defect Public/Granted day:2019-11-21
Information query
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