Invention Grant
- Patent Title: Array-type ultrasonic sensor
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Application No.: US17333681Application Date: 2021-05-28
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Publication No.: US11548031B2Publication Date: 2023-01-10
- Inventor: Yi-Hsiang Chiu , Hung-Ping Lee
- Applicant: SONICMEMS (ZHENGZHOU) TECHNOLOGY CO., LTD.
- Applicant Address: CN Zhengzhou
- Assignee: SONICMEMS (ZHENGZHOU) TECHNOLOGY CO., LTD.
- Current Assignee: SONICMEMS (ZHENGZHOU) TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Zhengzhou
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: TW110102393 20210121
- Main IPC: B06B1/06
- IPC: B06B1/06 ; G01N29/22

Abstract:
An array-type ultrasonic sensor includes a semiconductor substrate, a first sensing array, and a second sensing array. The first sensing array includes a plurality of first ultrasonic sensing units. Each of the first ultrasonic sensing units includes a first positive electrode and a first negative electrode. The first positive electrodes are connected in series with each other, and the first negative electrodes are connected in series with each other. The second sensing array includes a plurality of second ultrasonic sensing units. Each of the second ultrasonic sensing units includes a second positive electrode and a second negative electrode. The second positive electrodes are connected in series with each other, and the second negative electrodes are connected in series with each other. One of the first sensing array and the second sensing array is configured to transmit ultrasonic waves, and the other is configured to receive reflected ultrasonic waves.
Public/Granted literature
- US20220226862A1 ARRAY-TYPE ULTRASONIC SENSOR Public/Granted day:2022-07-21
Information query
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