Invention Grant
- Patent Title: Injection molding material for magnesium thixomolding
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Application No.: US17207797Application Date: 2021-03-22
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Publication No.: US11548066B2Publication Date: 2023-01-10
- Inventor: Koichi Ozaki , Tadao Fukuta , Yasutoshi Hideshima , Hidefumi Nakamura
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SEIKO EPSON CORPORATION
- Current Assignee: SEIKO EPSON CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Global IP Counselors, LLP
- Priority: JPJP2020-050632 20200323
- Main IPC: B22F1/00
- IPC: B22F1/00 ; B22F3/22

Abstract:
An injection molding material for magnesium thixomolding includes: a powder containing Mg as a main component; and a chip containing Mg as a main component, in which a proportion of the powder in the injection molding material for magnesium thixomolding is 5 mass % or more and 45 mass % or less, and a tap density of the powder is 0.15 g/cm3 or more.
Public/Granted literature
- US20210291262A1 INJECTION MOLDING MATERIAL FOR MAGNESIUM THIXOMOLDING Public/Granted day:2021-09-23
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