Invention Grant
- Patent Title: Method of producing spherical silver powder
-
Application No.: US17260220Application Date: 2019-07-17
-
Publication No.: US11548068B2Publication Date: 2023-01-10
- Inventor: Kemmei Otsubo , Koji Hirata
- Applicant: DOWA Electronics Materials Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: DOWA Electronics Materials Co., Ltd.
- Current Assignee: DOWA Electronics Materials Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Kenja IP Law PC
- Priority: JPJP2018-134378 20180717
- International Application: PCT/JP2019/028139 WO 20190717
- International Announcement: WO2020/017564 WO 20200123
- Main IPC: B22F9/24
- IPC: B22F9/24 ; B82Y30/00

Abstract:
Provided is a method of producing spherical silver powder, which makes it possible to easily produce spherical silver powder having primary particle diameters with less variation than conventional powder and spherical silver powder obtained by the method.
The method of producing spherical silver powder includes a reduction precipitation step of precipitating silver particles by reduction by adding a reductant including hydrazine carbonate to an aqueous reaction system containing silver ions.
The method of producing spherical silver powder includes a reduction precipitation step of precipitating silver particles by reduction by adding a reductant including hydrazine carbonate to an aqueous reaction system containing silver ions.
Public/Granted literature
- US20210268583A1 METHOD OF PRODUCING SPHERICAL SILVER POWDER Public/Granted day:2021-09-02
Information query