Invention Grant
- Patent Title: Injection apparatus
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Application No.: US17035753Application Date: 2020-09-29
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Publication No.: US11548196B2Publication Date: 2023-01-10
- Inventor: Koichi Yokoyama
- Applicant: SODICK CO., LTD.
- Applicant Address: JP Kanagawa
- Assignee: SODICK CO., LTD.
- Current Assignee: SODICK CO., LTD.
- Current Assignee Address: JP Kanagawa
- Agency: JCIPRNET
- Priority: JPJP2019-197190 20191030
- Main IPC: B29C45/54
- IPC: B29C45/54 ; B29C45/00 ; B29C45/58 ; B29C45/60 ; B29C45/46 ; B29C45/53 ; B29C45/77 ; B29C45/62 ; B29K19/00 ; B29K101/12

Abstract:
An injection apparatus of the invention injects a molding material supplied from a material supply port, and includes a die, a material supply apparatus that extrudes the molding material that is thread-like or strip-like via the die, and a material guide apparatus that guides the molding material supplied via the die to the material supply port. The material discharge port of the material supply apparatus and the die protrude downward in the material supply apparatus, and a pressure inside the material guide apparatus is reduced by a pressure reducing apparatus from a pressure reducing port provided above the material discharge port of the material supply apparatus and the die.
Public/Granted literature
- US20210129402A1 INJECTION APPARATUS Public/Granted day:2021-05-06
Information query
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