Invention Grant
- Patent Title: Temperature adjustment circuit
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Application No.: US17357192Application Date: 2021-06-24
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Publication No.: US11548347B2Publication Date: 2023-01-10
- Inventor: Hiroyuki Ono , Toru Ogaki , Seiji Isotani , Kazumi Yamazaki
- Applicant: HONDA MOTOR CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: HONDA MOTOR CO., LTD.
- Current Assignee: HONDA MOTOR CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Paratus Law Group, PLLC
- Priority: JPJP2020-111177 20200629
- Main IPC: B60H1/32
- IPC: B60H1/32 ; B60H1/00 ; B60H1/03

Abstract:
A temperature adjustment circuit for a vehicle includes a first temperature adjustment circuit for vehicle interior air conditioning or heating, a second temperature adjustment circuit that is configured to transfer heat with a battery, a connection path that is configured to connect the first temperature adjustment circuit and the second temperature adjustment circuit to form a connection circuit, and a first valve and a second valve that are configured to switch between an independent state where the first temperature adjustment circuit and the second temperature adjustment circuit are independent and a connection state where the connection circuit is formed.
Public/Granted literature
- US20210402845A1 TEMPERATURE ADJUSTMENT CIRCUIT Public/Granted day:2021-12-30
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