Invention Grant
- Patent Title: Component addition polymerization
-
Application No.: US16759079Application Date: 2018-10-24
-
Publication No.: US11548955B2Publication Date: 2023-01-10
- Inventor: Andrew M. Savo , Alfred K. Schultz , Kenneth Laughlin , John Reffner
- Applicant: DDP SPECIALTY ELECTRONIC MATERIALS US, INC. , DDP SPECIALTY ELECTRONIC MATERIALS US 8, LLC
- Applicant Address: US PA Collegeville; US PA Collegeville
- Assignee: DDP SPECIALTY ELECTRONIC MATERIALS US, INC.,DDP SPECIALTY ELECTRONIC MATERIALS US 8, LLC
- Current Assignee: DDP SPECIALTY ELECTRONIC MATERIALS US, INC.,DDP SPECIALTY ELECTRONIC MATERIALS US 8, LLC
- Current Assignee Address: US PA Collegeville; US PA Collegeville
- International Application: PCT/US2018/057284 WO 20181024
- International Announcement: WO2019/094191 WO 20190516
- Main IPC: C08F212/08
- IPC: C08F212/08 ; C08F212/36 ; C08F2/18 ; C08F12/36

Abstract:
Provided is a collection of polymeric beads, wherein the beads comprise (i) 75 to 99% by weight, based on the weight of the bead, polymerized units of monofunctional vinyl monomer, and (ii) 1 to 25% by weight, based on the weight of the bead, polymerized units of multifunctional vinyl monomer; wherein, within each bead, the average concentration of moles of polymerized units of multifunctional vinyl monomer per cubic micrometer is MVAV; wherein, within each bead, T1000 is a sequence of 1,000 unique connected polymerized monomer units; wherein, within each T1000, MVSEQ is the weight percent polymerized units of multifunctional vinyl monomer, based on the weight of T1000; wherein MVRATIO=MVSEQ/MVAV; and wherein 90% or more of the beads by volume are uniform beads, wherein a uniform bead is a bead in which 90% or more of all T1000 sequences has MVRATIO of 1.5 or less.
Public/Granted literature
- US20200325251A1 COMPONENT ADDITION POLYMERIZATION Public/Granted day:2020-10-15
Information query
IPC分类: