Invention Grant
- Patent Title: Curable epoxy system
-
Application No.: US16955111Application Date: 2018-12-17
-
Publication No.: US11548978B2Publication Date: 2023-01-10
- Inventor: Derek Kincaid , Dong Le , Madhi Ghazizadeh , Tao Tao
- Applicant: Huntsman Advanced Materials Americas LLC
- Applicant Address: US TX The Woodlands
- Assignee: Huntsman Advanced Materials Americas LLC
- Current Assignee: Huntsman Advanced Materials Americas LLC
- Current Assignee Address: US TX The Woodlands
- Agency: Huntsman Advanced Materials Americas LLC
- Agent Lewis D. Craft
- International Application: PCT/US2018/066077 WO 20181217
- International Announcement: WO2019/126073 WO 20190627
- Main IPC: C08J5/24
- IPC: C08J5/24 ; B32B27/38 ; C08G59/24 ; C08G59/30 ; C08G59/56 ; C08G59/50 ; C08K7/06

Abstract:
A curable epoxy system useful in the production of composites capable of being used in various industries, including, for example, the aerospace industry. In particular, the present disclosure relates to a curable epoxy system comprising (i) an epoxy component selected from bisphenol C diglycidyl ether, one or more derivatives of bisphenol C diglycidyl ether, and combinations thereof, and (ii) 9,9-bis(4-amino-3-chlorophenyl)fluorene.
Information query