Invention Grant
- Patent Title: Pressure sensitive adhesive composition and methods for its preparation and use in flexible organic light emitting diode applications
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Application No.: US16635316Application Date: 2018-10-17
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Publication No.: US11549039B2Publication Date: 2023-01-10
- Inventor: Wonbum Jang , Kyung Dong Han , Bo Kyung Bona Kim
- Applicant: Dow Silicones Corporation
- Applicant Address: US MI Midland
- Assignee: Dow Silicones Corporation
- Current Assignee: Dow Silicones Corporation
- Current Assignee Address: US MI Midland
- Agent Catherine U. Brown
- International Application: PCT/US2018/056175 WO 20181017
- International Announcement: WO2019/079366 WO 20190425
- Main IPC: C09J183/04
- IPC: C09J183/04 ; C09J7/38 ; B32B7/12 ; B32B37/12
Abstract:
A pressure sensitive adhesive composition can cure via hydrosilylation to form a pressure sensitive adhesive. The pressure sensitive adhesive composition may be coated on a substrate and cured to form a protective film. The protective film is useful in flexible OLED device fabrication processes, e.g., for protection of passivation layers.
Information query
IPC分类:
