Invention Grant
- Patent Title: Duct panel
-
Application No.: US16319698Application Date: 2017-07-25
-
Publication No.: US11549719B2Publication Date: 2023-01-10
- Inventor: Kwan Heng Chan
- Applicant: Instad Pre Fabrication Pte Ltd
- Applicant Address: SG Singapore
- Assignee: Instad Pre Fabrication Pte Ltd
- Current Assignee: Instad Pre Fabrication Pte Ltd
- Current Assignee Address: SG Singapore
- Agency: Thomas | Horstemeyer, LLP
- Priority: SG10201606130V 20160725
- International Application: PCT/SG2017/050377 WO 20170725
- International Announcement: WO2018/021969 WO 20180201
- Main IPC: F24F13/02
- IPC: F24F13/02

Abstract:
A duct panel, a method of manufacturing a duct panel, a duct section and a method of installing a duct are disclosed. The duct panel includes a laminate structure having an insulation layer disposed between a first support layer and a second support layer, the laminate structure having an end width; and an end cap attached to the end width and configured to be coupled to a mounting flange, wherein the mounting flange is configured to mount the duct panel. The end cap and the mounting flange comprise different materials.
Public/Granted literature
- US20190353390A1 DUCT PANEL Public/Granted day:2019-11-21
Information query