Invention Grant
- Patent Title: Heat exchanger and heat pump device
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Application No.: US17562302Application Date: 2021-12-27
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Publication No.: US11549733B2Publication Date: 2023-01-10
- Inventor: Tomoki Hirokawa , Tooru Andou , Yoshiyuki Matsumoto , Hideyuki Kusaka , Hirokazu Fujino , Kouju Yamada
- Applicant: DAIKIN INDUSTRIES, LTD.
- Applicant Address: JP Osaka
- Assignee: DAIKIN INDUSTRIES, LTD.
- Current Assignee: DAIKIN INDUSTRIES, LTD.
- Current Assignee Address: JP Osaka
- Agency: Osha Bergman Watanabe & Burton LLP
- Priority: JPJP2019-122166 20190628
- Main IPC: F25B41/42
- IPC: F25B41/42 ; F25B39/00 ; F28F9/02

Abstract:
A heat exchanger includes heat transfer tubes and a header that forms a refrigerant flow path. The header includes: a first member that includes a first plate-shaped portion; a second member that includes a second plate-shaped portion; a third member that includes a third plate-shaped portion positioned between the first plate-shaped portion and the second plate-shaped portion in a first direction that is a direction in which the first plate-shaped portion and the second plate-shaped portion are arranged; a fourth member that includes a fourth plate-shaped portion positioned between the first plate-shaped portion and the second plate-shaped portion in the first direction and a second opening that constitutes a part of the refrigerant flow path, where a second is along a longitudinal direction of the second opening; and a fifth member.
Public/Granted literature
- US20220120481A1 HEAT EXCHANGER AND HEAT PUMP DEVICE Public/Granted day:2022-04-21
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