Invention Grant
- Patent Title: Probing system
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Application No.: US17182629Application Date: 2021-02-23
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Publication No.: US11549968B2Publication Date: 2023-01-10
- Inventor: Choon Leong Lou
- Applicant: TECAT TECHNOLOGIES (SUZHOU) LIMITED
- Applicant Address: CN Suzhou
- Assignee: TECAT TECHNOLOGIES (SUZHOU) LIMITED
- Current Assignee: TECAT TECHNOLOGIES (SUZHOU) LIMITED
- Current Assignee Address: CN Suzhou
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: CN202120088768.4 20210113
- Main IPC: G01R1/067
- IPC: G01R1/067 ; G01R1/44 ; G01R31/28 ; G01K7/22

Abstract:
A probing system includes a chuck configured to support a device under test (DUT); and a manipulator disposed above the chuck and including a first probe protruding from the manipulator toward the chuck, wherein the first probe includes a temperature-sensing device for sensing a temperature adjacent to a front surface of the DUT. A probing device includes a chuck; a DUT disposed over the chuck; a manipulator disposed above the DUT, wherein the manipulator includes a first probe protruding from the manipulator toward the DUT and including a temperature-sensing device for sensing a temperature, the DUT is moved toward the manipulator for sensing a temperature of the DUT by the first probe.
Public/Granted literature
- US20220221492A1 PROBING SYSTEM Public/Granted day:2022-07-14
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