A backlight module includes a cover plate, a light guide plate, a circuit board, a reflective layer, and a light source. The light guide plate is disposed under the cover plate and has a first hole corresponding to a light-shielding region of the cover plate. The circuit board is disposed under the light guide plate and includes a first substrate and a conductive layer having a through hole. The reflective layer is disposed between the light guide plate and the circuit board and has a second hole. The first substrate is in contact with the reflective layer. The conductive layer is disposed between the first substrate and the reflective layer having a recess recessed into the through hole. The light source is disposed on the circuit board, accommodated in the first hole and the second hole corresponding thereto, and in contact with the conductive layer.