Invention Grant
- Patent Title: Structures and methods for high speed interconnection in photonic systems
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Application No.: US17007743Application Date: 2020-08-31
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Publication No.: US11550102B2Publication Date: 2023-01-10
- Inventor: Weiwei Song , Stefan Rusu , Mohammed Rabiul Islam
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Duane Morris LLP
- Main IPC: G02B6/132
- IPC: G02B6/132 ; G02B6/136 ; H04B10/25 ; G02B6/12

Abstract:
Structures and methods for high speed interconnection in photonic systems are described herein. In one embodiment, a photonic device is disclosed. The photonic device includes: a substrate; a plurality of metal layers on the substrate; a photonic material layer comprising graphene over the plurality of metal layers; and an optical routing layer comprising a waveguide on the photonic material layer.
Public/Granted literature
- US20220066099A1 STRUCTURES AND METHODS FOR HIGH SPEED INTERCONNECTION IN PHOTONIC SYSTEMS Public/Granted day:2022-03-03
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