• Patent Title: Reflective mask blank, reflective mask, method of manufacturing reflective mask, and method of manufacturing semiconductor device
  • Application No.: US17056676
    Application Date: 2019-05-24
  • Publication No.: US11550215B2
    Publication Date: 2023-01-10
  • Inventor: Yohei IkebeTsutomu Shoki
  • Applicant: HOYA CORPORATION
  • Applicant Address: JP Tokyo
  • Assignee: HOYA CORPORATION
  • Current Assignee: HOYA CORPORATION
  • Current Assignee Address: JP Tokyo
  • Agency: Kilpatrick Townsend & Stockton LLP
  • Priority: JPJP2018-100363 20180525,JPJP2018-165248 20180904
  • International Application: PCT/JP2019/020635 WO 20190524
  • International Announcement: WO2019/225737 WO 20191128
  • Main IPC: G03F1/32
  • IPC: G03F1/32 G03F1/24
Reflective mask blank, reflective mask, method of manufacturing reflective mask, and method of manufacturing semiconductor device
Abstract:
Provided is a reflective mask blank with which it is possible to further reduce the shadowing effect of a reflective mask, and also possible to form a fine and highly accurate phase-shift pattern. A reflective mask blank having, in the following order on a substrate, a multilayer reflective film and a phase-shift film that shifts the phase of EUV light, said reflective mask blank characterized in that: the phase-shift film has a first layer and a second layer; the first layer comprises a material that contains at least one element from among tantalum (Ta) and chromium (Cr); and the second layer comprises a metal-containing material that contains ruthenium (Ru) and at least one element from among chromium (Cr), nickel (Ni), cobalt (Co), vanadium (V), niobium (Nb), molybdenum (Mo), tungsten (W), and rhenium (Re).
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