- Patent Title: Chemically amplified positive-type photosensitive resin composition, photosensitive dry film, method of manufacturing photosensitive dry film, method of manufacturing patterned resist film, method of manufacturing substrate with template, method of manufacturing plated article, and nitrogen-containing aromatic heterocyclic compound
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Application No.: US16447262Application Date: 2019-06-20
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Publication No.: US11550221B2Publication Date: 2023-01-10
- Inventor: Kazuaki Ebisawa
- Applicant: TOKYO OHKA KOGYO CO., LTD.
- Applicant Address: JP Kawasaki
- Assignee: TOKYO OHKA KOGYO CO., LTD.
- Current Assignee: TOKYO OHKA KOGYO CO., LTD.
- Current Assignee Address: JP Kawasaki
- Agency: Knobbe, Martens, Olson & Bear LLP
- Priority: JPJP2018-122522 20180627
- Main IPC: G03F7/039
- IPC: G03F7/039 ; G03F7/16 ; C08K5/3432 ; G03F7/004 ; G03F7/06 ; C08L33/02 ; C08L33/14

Abstract:
A chemically amplified positive-type photosensitive resin composition including an acid generator which generates acid upon exposure to an irradiated active ray or radiation, a resin whose solubility in alkali increases under the action of acid, and a nitrogen-containing aromatic heterocyclic compound that is a nitrogen-containing aromatic heterocyclic compound having a specific structure and having a Log S value of −6.00 or less.
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