Invention Grant
- Patent Title: Lithography system and operation method thereof
-
Application No.: US16410426Application Date: 2019-05-13
-
Publication No.: US11550233B2Publication Date: 2023-01-10
- Inventor: Chi-Hung Liao , Min-Cheng Wu
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Maschoff Brennan
- Main IPC: G03F7/20
- IPC: G03F7/20 ; H05G2/00

Abstract:
A method including steps as follows is provided. A primary droplet and a satellite droplet are shot toward an excitation zone. The satellite droplet is deflected away from the excitation zone. A laser beam is emitted toward the excitation zone to excite the primary droplet to generate an extreme ultraviolet (EUV) light. The EUV light is directed onto a reticle using a first optical reflector, such that the EUV light is imparted with a pattern of the reticle. The EUV light with the pattern is directed onto a wafer using a second optical reflector.
Public/Granted literature
- US20200057364A1 LITHOGRAPHY SYSTEM AND OPERATION METHOD THEREOF Public/Granted day:2020-02-20
Information query
IPC分类: