Invention Grant
- Patent Title: Ruggedized edge computing assembly
-
Application No.: US17247919Application Date: 2020-12-30
-
Publication No.: US11550277B2Publication Date: 2023-01-10
- Inventor: Jonathan Lovegrove
- Applicant: MORPHIX, INC.
- Applicant Address: US WA Vancouver
- Assignee: MORPHIX, INC.
- Current Assignee: MORPHIX, INC.
- Current Assignee Address: US WA Vancouver
- Agency: Alleman Hall Creasman & Tuttle LLP
- Main IPC: H01R27/00
- IPC: H01R27/00 ; G05B19/04 ; G05B19/045 ; G05B19/048 ; H04L67/125 ; G16Y20/20 ; G16Y40/35 ; G16Y10/25 ; G16Y20/10 ; H01R13/639 ; H01R13/52 ; H01R13/73

Abstract:
A ruggedized edge computing assembly is provided, which includes an edge computing device having a processor configured to control a controlled device. The ruggedized edge computing assembly includes a field connector configured to connect to the edge computing device via a plurality of pins and to the controlled device via a coupling. The ruggedized edge computing assembly further includes a housing overmolded around each of the field connector and the edge computing device. The housing includes two portions which are a field connector portion configured to accommodate the field connector and an edge computing device portion configured to accommodate the edge computing device. The two portions are configured to interlockingly engage together at an interface.
Public/Granted literature
- US20220206450A1 RUGGEDIZED EDGE COMPUTING ASSEMBLY Public/Granted day:2022-06-30
Information query