Invention Grant
- Patent Title: Mass flow control system, and semiconductor manufacturing equipment and vaporizer including the system
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Application No.: US16647513Application Date: 2018-09-25
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Publication No.: US11550341B2Publication Date: 2023-01-10
- Inventor: Mamoru Ishii
- Applicant: Hitachi Metals, Ltd.
- Applicant Address: JP Tokyo
- Assignee: Hitachi Metals, Ltd.
- Current Assignee: Hitachi Metals, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Neugeboren O'Dowd PC
- Priority: JPJP2017-190657 20170929
- International Application: PCT/JP2018/035403 WO 20180925
- International Announcement: WO2019/065611 WO 20190404
- Main IPC: G05D7/06
- IPC: G05D7/06 ; G05D11/13 ; G05D21/02

Abstract:
In a mass flow control system which comprises a first apparatus that is a mass flow controller, an external sensor that is at least one detection means constituting a second apparatus that is an apparatus disposed outside said first apparatus and at least one control section prepared in either one or both of housings of said first apparatus and said second apparatus, and is configured so as to control a flow rate of fluid flowing through a channel, the control section is configured such that opening of a flow control valve can be controlled based on at least an external signal that is a detection signal output from the external sensor.
Public/Granted literature
- US20210405667A1 MASS FLOW CONTROL SYSTEM, AND SEMICONDUCTOR MANUFACTURING EQUIPMENT AND VAPORIZER INCLUDING THE SYSTEM Public/Granted day:2021-12-30
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