Invention Grant
- Patent Title: Vapor chamber lids
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Application No.: US16882419Application Date: 2020-05-22
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Publication No.: US11550373B2Publication Date: 2023-01-10
- Inventor: Pritish Ranjan Parida
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Otterstedt & Kammer PLLC
- Agent Daniel Morris
- Main IPC: G06F1/20
- IPC: G06F1/20 ; F28F9/00 ; G06F30/20 ; H01L23/427 ; G06F111/10

Abstract:
Obtain a putative design for a vapor chamber lid for an electronic device; iteratively: obtain a steady state solution of governing equations of the putative design, wherein the governing equations include a thermal energy equation in a solid domain of the putative design and include continuity, momentum, and energy equations in vapor and liquid/wick domains of the putative design; modify the putative design in response to a difference between the evaporator temperature of the steady state solution and a threshold value for evaporator temperature; and obtain a new steady state solution of the governing equations for the putative design; and set a final design for the vapor chamber lid when a satisfactory result is obtained for the difference between the evaporator temperature and the threshold value for evaporator temperature.
Public/Granted literature
- US20210365088A1 VAPOR CHAMBER LIDS Public/Granted day:2021-11-25
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