- Patent Title: Method for photolithography to manufacture a two-sided touch sensor
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Application No.: US16848400Application Date: 2020-04-14
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Publication No.: US11550433B2Publication Date: 2023-01-10
- Inventor: Robert Petcavich , Robert Routh , Michael Morrione
- Applicant: FUTURETECH CAPITAL, INC.
- Applicant Address: US CA Palo Alto
- Assignee: FUTURETECH CAPITAL, INC.
- Current Assignee: FUTURETECH CAPITAL, INC.
- Current Assignee Address: US CA Palo Alto
- Agency: Womble Bond Dickinson (US) LLP
- Agent Joseph Bach, Esq.
- Main IPC: G06F3/044
- IPC: G06F3/044 ; H05K3/06 ; G06F3/045

Abstract:
A touch sensor having conductive circuits on both surfaces of a substrate is fabricated by including UV-blocking material into the substrate or depositing UV-blocking layer on the substrate. This can be used for fabricating sensors having transparent conductor circuits, or having metallic circuits, which are opaque to visible light. Photoresist is applied to both surfaces of the substrate and patterns are transferred to the photoresist by exposure to UV radiation. The UV-blocking layer prevents UV-radiation applied to one side from exposing the opposite side. If desired, both photoresist layers may be exposed simultaneously by splitting one UV beam.
Public/Granted literature
- US20210318769A1 METHOD FOR PHOTOLITHOGRAPHY TO MANUFACTURE A TWO-SIDED TOUCH SENSOR Public/Granted day:2021-10-14
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