- Patent Title: Card inlay for direct connection or inductive coupling technology
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Application No.: US17390047Application Date: 2021-07-30
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Publication No.: US11551050B2Publication Date: 2023-01-10
- Inventor: Alejandro Placitelli , Joe Lo , Holger Roessner
- Applicant: AdvanIDe Holdings Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: AdvanIDe Holdings Pte. Ltd.
- Current Assignee: AdvanIDe Holdings Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: Maier & Maier, PLLC
- Priority: SG10202011277T 20201112
- Main IPC: G06K19/077
- IPC: G06K19/077 ; H01Q1/22

Abstract:
An inlay for a chip card. The inlay includes a module coupling antenna for inductively coupling to a chip module antenna of a chip module and a card reader coupling antenna for inductively coupling to a reader antenna of an external card reader. The card reader coupling antenna is electrically connected to the module coupling antenna. The inlay also includes a chip capacitor module that is electrically connected to the card reader coupling antenna for enabling the card reader coupling antenna to resonate at a predetermined frequency. The chip capacitor module includes at least one passive component for storing electrical energy. The at least one passive component has a capacitance within a range from 40 picofarads to 140 picofarads and a major area that is smaller than 2.6 square millimetres.
Public/Granted literature
- US11507794B2 Card inlay for direct connection or inductive coupling technology Public/Granted day:2022-11-22
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