Invention Grant
- Patent Title: High density microwave hermetic interconnects for quantum applications
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Application No.: US16281657Application Date: 2019-02-21
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Publication No.: US11551125B2Publication Date: 2023-01-10
- Inventor: Nicholas T. Bronn , Patryk Gumann , Sean Hart , Salvatore B. Olivadese
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Amin, Turocy & Watson, LLP
- Main IPC: G06N10/00
- IPC: G06N10/00 ; H01P3/06 ; H01P5/08

Abstract:
A quantum computer includes a refrigeration system under vacuum including a containment vessel, a qubit chip contained within a refrigerated vacuum environment defined by the containment vessel. The quantum computer further includes a plurality of interior electromagnetic waveguides and a plurality of exterior electromagnetic waveguides. The quantum computer further includes a hermetic connector assembly operatively connecting the interior electromagnetic waveguides to the exterior electromagnetic waveguides while maintaining the refrigerated vacuum environment. The hermetic connector assembly includes an exterior multi-waveguide connector, an interior multi-waveguide connector, and a dielectric plate arranged between and hermetically sealed with the exterior multi-waveguide connector and the interior multi-waveguide connector. The dielectric plate permits electromagnetic energy when carried by the interior and exterior pluralities of electromagnetic waveguides to pass therethrough.
Public/Granted literature
- US20200272927A1 HIGH DENSITY MICROWAVE HERMETIC INTERCONNECTS FOR QUANTUM APPLICATIONS Public/Granted day:2020-08-27
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