Invention Grant
- Patent Title: Apparatus with circuit-locating mechanism
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Application No.: US16536470Application Date: 2019-08-09
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Publication No.: US11551777B2Publication Date: 2023-01-10
- Inventor: Itamar Lavy , Chunhao Wang , Wesley B. Butler
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Main IPC: H01L23/544
- IPC: H01L23/544 ; G11C29/44 ; H01L21/67 ; G11C29/04
Abstract:
An apparatus includes a substrate; circuit components disposed on the substrate; and a location identifier layer over the circuit, wherein the location identifier layer includes one or more section labels for representing physical locations of the circuit components within the apparatus.
Public/Granted literature
- US20210043267A1 APPARATUS WITH CIRCUIT-LOCATING MECHANISM Public/Granted day:2021-02-11
Information query
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