- Patent Title: Module substrate antenna, and module substrate mounting the same
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Application No.: US16367787Application Date: 2019-03-28
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Publication No.: US11551851B2Publication Date: 2023-01-10
- Inventor: Jun Koujima , Mark Chang , Yoshiteru Kouno , Peter Yan
- Applicant: TODA KOGYO CORP. , Securitag Assembly Group Co., Ltd.
- Applicant Address: JP Hiroshima; TW Taichung
- Assignee: TODA KOGYO CORP.,Securitag Assembly Group Co., Ltd.
- Current Assignee: TODA KOGYO CORP.,Securitag Assembly Group Co., Ltd.
- Current Assignee Address: JP Hiroshima; TW Taichung
- Agency: Alston & Bird LLP
- Priority: JPJP2018-068276 20180330
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F17/00 ; H01F27/29 ; H05K1/02 ; H05K1/16 ; H05K1/18 ; H01Q7/06
Abstract:
A module substrate antenna includes: a laminate in which a plurality of ferrite layers are stacked; antennal coils provided on surfaces of the respective ferrite layers; a connection pad connected to an external circuit; and a lead wire provided between the laminate and the connection pad. In the laminate, the antenna coils are two types of the antenna coils, and the two types of the antenna coils are alternately stacked.
Public/Granted literature
- US20190304662A1 MODULE SUBSTRATE ANTENNA, AND MODULE SUBSTRATE MOUNTING THE SAME Public/Granted day:2019-10-03
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