Invention Grant
- Patent Title: Coil component, circuit board, and electronic device
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Application No.: US17129142Application Date: 2020-12-21
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Publication No.: US11551853B2Publication Date: 2023-01-10
- Inventor: Hidenori Aoki , Tomoo Kashiwa
- Applicant: TAIYO YUDEN CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Pillsbury Winthrop Shaw Pittman, LLP
- Priority: JPJP2019-239125 20191227
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F27/29 ; H05K1/18

Abstract:
A coil component includes a base body containing metal magnetic particles and a binder binding together the metal magnetic particles and having a first surface extending along a coil axis and a second surface opposing the first surface, a first external electrode provided on the base body, a second external electrode provided on the base body, and a coil conductor electrically connected to the first and second external electrodes and extending around the coil axis. In one embodiment, the coil conductor has a winding portion, the winding portion has first conductor portions and one or more second conductor portions smaller in number than the first conductor portions, and the first and second conductor portions alternate with and are connected to each other, and a distance between the first conductor portions and the first surface is less than a distance between the second conductor portions and the second surface.
Public/Granted literature
- US20210202153A1 COIL COMPONENT, CIRCUIT BOARD, AND ELECTRONIC DEVICE Public/Granted day:2021-07-01
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