Invention Grant
- Patent Title: Coil component, circuit board, and electronic device
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Application No.: US17186994Application Date: 2021-02-26
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Publication No.: US11551856B2Publication Date: 2023-01-10
- Inventor: Satoshi Tokunaga , Tomoo Kashiwa
- Applicant: TAIYO YUDEN CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Pillsbury Winthrop Shaw Pittman, LLP
- Priority: JPJP2020-034495 20200229
- Main IPC: H01F27/29
- IPC: H01F27/29 ; H05K1/18 ; H01F27/245 ; H01F41/04 ; H01F41/02 ; H01F27/28

Abstract:
A coil component according to one or more embodiments includes a base body having first to sixth surfaces, and a coil conductor including a winding portion that extends around a coil axis intersecting the first and second surfaces. The winding portion includes first, second, third, and fourth portions facing the third, fourth, fifth, and sixth surfaces, respectively when viewed from a direction of the coil axis. The radii of curvature of the first and second portions are both smaller than the radii of curvature of the third and fourth portions. When viewed from the direction of the coil axis, the distance between the first portion and the third surface and the distance between the second portion and the fourth surface are both larger than the distance between the third portion and the fifth surface and the distance between the fourth portion and the sixth surface.
Public/Granted literature
- US20210272744A1 COIL COMPONENT, CIRCUIT BOARD, AND ELECTRONIC DEVICE Public/Granted day:2021-09-02
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