Invention Grant
- Patent Title: Electronic component
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Application No.: US17124424Application Date: 2020-12-16
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Publication No.: US11551865B2Publication Date: 2023-01-10
- Inventor: Tomohiro Dozen , Yasuo Matsumoto
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto-fu
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto-fu
- Agency: Studebaker & Brackett PC
- Priority: JPJP2019-230017 20191220
- Main IPC: H01G4/008
- IPC: H01G4/008 ; B32B15/01 ; C22C9/00 ; C22C13/00 ; C22C19/03 ; H01G4/232

Abstract:
An electronic component includes a component body, a base electrode that has a surface exposed from the component body and contains at least one of silver and copper, an alloy layer deposited on the surface of the base electrode, and a nickel layer deposited on a surface of the alloy layer. The material of the alloy layer is an alloy containing nickel and tin.
Public/Granted literature
- US20210193386A1 ELECTRONIC COMPONENT Public/Granted day:2021-06-24
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