An advanced process control system including a first process tool, a second process tool, and a measurement tool is provided. The first processing tool is configured to process each of a plurality of wafers by one of a plurality of first masks, and provide a first process timing data. The second processing tool is configured to process the wafer processing by the first process tool by one of a plurality of second masks to provide a plurality of works. The second process tool provides a measurement trigger signal according to the first process timing data. The measuring tool is configured to determine whether to perform a measuring operation on each works in response to the measurement trigger signal, and correspondingly provide a measurement result.