Invention Grant
- Patent Title: Apparatus and method for transferring wafers
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Application No.: US16881749Application Date: 2020-05-22
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Publication No.: US11551958B2Publication Date: 2023-01-10
- Inventor: Chung-Hsung Yang , Yung-Ho Chen
- Applicant: Taiwan Semiconductor Manufacturing Company Limited
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee Address: TW Hsinchu
- Agency: Foley & Lardner LLP
- Main IPC: H01L21/677
- IPC: H01L21/677 ; B65G47/90 ; H01L21/67

Abstract:
An illustrative embodiment disclosed herein is an apparatus including a first loading tray configured to couple to a first wafer holding device holding a plurality of wafers. The first wafer holding device includes a first opening. The apparatus includes a second loading tray configured to couple to a second wafer holding device. The second wafer holding device includes a second opening. The apparatus includes a first motor coupled to the first loading tray and configured to rotate the first wafer holding device until the first opening faces the second opening to allow transfer of the plurality of wafers from the first wafer holding device to the second wafer holding device.
Public/Granted literature
- US20210366752A1 APPARATUS AND METHOD FOR TRANSFERRING WAFERS Public/Granted day:2021-11-25
Information query
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