Invention Grant
- Patent Title: Methods for improvement of photoresist patterning profile
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Application No.: US17315201Application Date: 2021-05-07
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Publication No.: US11551977B2Publication Date: 2023-01-10
- Inventor: Ke-Ming Chen , Ting-Jung Chang , Hsin-Chen Cheng , Chih-Tsang Tseng
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Seed IP Law Group LLP
- Main IPC: H01L21/8234
- IPC: H01L21/8234 ; H01L29/40 ; H01L21/02 ; G11C5/06 ; H01L21/8238 ; H01L29/417

Abstract:
A method of forming a semiconductor structure is provided. The method includes forming a gate structure over an active region of a substrate, forming an epitaxial layer comprising first dopants of a first conductivity type over portions of the active region on opposite sides of the gate structure, applying a cleaning solution comprising ozone and deionized water to the epitaxial layer, thereby forming an oxide layer on the epitaxial layer, forming a patterned photoresist layer over the oxide layer and the gate structure to expose a portion of the oxide layer, forming a contact region including second dopants of a second conductivity type opposite the first conductivity type in the portion of the epitaxial layer not covered by the patterned photoresist layer, and forming a contact overlying the contact region.
Public/Granted literature
- US20220359297A1 METHODS FOR IMPROVEMENT OF PHOTORESIST PATTERNING PROFILE Public/Granted day:2022-11-10
Information query
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