Invention Grant
- Patent Title: Component carrier and method of manufacturing the same
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Application No.: US16949407Application Date: 2020-10-28
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Publication No.: US11551989B2Publication Date: 2023-01-10
- Inventor: Heinz Moitzi
- Applicant: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Applicant Address: AT Leoben
- Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Current Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Current Assignee Address: AT Leoben
- Agency: Smith Tempel Blaha LLC
- Agent Robert A. Blaha
- Priority: EP19218396 20191220
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H01L23/31 ; H01L21/56 ; H01L23/485 ; H01L23/29 ; H05K1/03
Abstract:
A component carrier includes a stack having at least one electrically conductive layer structure and at least one electrically insulating layer structure; a barrier structure; and a component. The component has at least one pad embedded in the stack and/or in the barrier structure. At least a portion of one of the electrically conductive layer structure and the at least one pad includes copper in contact with the barrier structure.
Public/Granted literature
- US20210193541A1 Component Carrier and Method of Manufacturing the Same Public/Granted day:2021-06-24
Information query
