Invention Grant
- Patent Title: Wiring structure having stacked first and second electrodes
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Application No.: US17233786Application Date: 2021-04-19
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Publication No.: US11552004B2Publication Date: 2023-01-10
- Inventor: Takayuki Matsumoto , Tsukasa Nakanishi , Yukinori Hatori
- Applicant: Shinko Electric Industries, Co., Ltd.
- Applicant Address: JP Nagano
- Assignee: Shinko Electric Industries, Co., Ltd.
- Current Assignee: Shinko Electric Industries, Co., Ltd.
- Current Assignee Address: JP Nagano
- Agency: Tarolli, Sundheim, Covell & Tummino LLP 3
- Priority: JPJP2020-076034 20200422
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/48 ; H01L21/00 ; H01R9/00 ; H05K7/18 ; H01L21/56 ; H01L23/31 ; H01L21/48
Abstract:
A wiring substrate includes a first metal plate and a second electrode. The first metal plate includes a first electrode, a wiring, and a mount portion for an electronic component. The mount portion includes an upper surface of the wiring. The second electrode is joined to an upper surface of the first electrode. The first electrode is solid. The second electrode is solid.
Public/Granted literature
- US20210335695A1 WIRING SUBSTRATE AND ELECTRONIC DEVICE Public/Granted day:2021-10-28
Information query
IPC分类:
