Invention Grant
- Patent Title: Coated semiconductor devices
-
Application No.: US16936290Application Date: 2020-07-22
-
Publication No.: US11552006B2Publication Date: 2023-01-10
- Inventor: Sreenivasan Kalyani Koduri
- Applicant: TEXAS INSTRUMENTS INCORPORATED
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Dawn Jos; Frank D. Cimino
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/31 ; H01L21/56 ; H05K1/18 ; H01L23/552 ; H05K3/34 ; H01L21/48
Abstract:
In examples, a semiconductor device comprises a semiconductor die, an opaque mold compound housing covering the semiconductor die, a conductive terminal extending from the mold compound housing, and an insulative coat covering the mold compound housing and at least a portion of the conductive terminal.
Public/Granted literature
- US20220028765A1 COATED SEMICONDUCTOR DEVICES Public/Granted day:2022-01-27
Information query
IPC分类:
