In a described example, an apparatus includes: a package substrate having a die pad configured for mounting a semiconductor die, and leads spaced from the die pad; a semiconductor die mounted on the die pad; a fuse mounted to a lead, the fuse having a fuse element coupled between a fuse cap and the lead, the fuse having a fuse body with an opening surrounding the fuse element, the fuse cap attached to the fuse body; electrical connections coupling the semiconductor die to the fuse; and mold compound covering the semiconductor die, the fuse, the electrical connections, and a portion of the package substrate, with portions of the leads exposed from the mold compound to form terminals.