Invention Grant
- Patent Title: Electronic package with stud bump electrical connections
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Application No.: US17392598Application Date: 2021-08-03
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Publication No.: US11552035B2Publication Date: 2023-01-10
- Inventor: Zhaozhi Li , Sanka Ganesan , Debendra Mallik , Gregory Perry , Kuan H. Lu , Omkar Karhade , Shawna M. Liff
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/498
Abstract:
An electronic package and method includes a substrate including a plurality of pads on a major surface. An electronic component including a plurality of pads on a major surface facing the major surface of the substrate. A stud bump electrically couples one of the plurality of pads of the substrate to one of the plurality of pads of the electronic component.
Public/Granted literature
- US20210366862A1 ELECTRONIC PACKAGE WITH STUD BUMP ELECTRICAL CONNECTIONS Public/Granted day:2021-11-25
Information query
IPC分类:
